Western Digital today announced that it has kicked off production of the industry’s densest 3D NAND flash chips, which stack 64 layers atop another and enable three bits of data to be stored in each cell. The 3D NAND flash chips are based on a vertical stacking or 3D technology that Western Digital and partner Toshiba call BiCS (Bit Cost Scaling). WD has launched its pilot production of its first 512 gigabit (Gb) 3D NAND chip based on the 64-layer NAND flash technology. In the same way a skyscraper allows for greater density in a smaller footprint, stacking NAND flash cells—versus planar or 2D memory -enables manufacturers to increase density, which enables lower cost per gigabyte of capacity. The technology also increases data reliability and improves the speed of solid-state memory. Read more at http://www.pcworld.com/article/3166099/storage/western-digital-begins-production-of-the-worlds-tallest-3d-nand-skyscraper.html
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